 
    ResinLab EP965SC7 Black is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part A, 1 gal Pail.
| Typical Use: | Designed for medium sized castings. | 
| Chemical Composition: | Epoxy | 
| Color: | Black | 
| Components: | 2 part | 
| Cure System: | Room Temperature/Heat | 
| Cure Time: | 24h @ room temperature; 1h @ 65 °C; 20min @ 110 °C | 
| Dielectric Strength: | 410 V/mil | 
| Elongation: | 5% to 8% @ break | 
| Flash Point: | 249 °C | 
| Hardness: | 80 D | 
| Mix Ratio: | 1:1 by volume; 100:85 by weight | 
| Service Temperature: | -40 to 150 °C | 
| Specific Gravity: | Part A: 1.16; Mixed: 1.07 | 
| Tensile Strength: | 7,500 psi | 
| Thermal Conductivity: | 0.14 W/mK | 
| Viscosity: | Part A: 16,000; Mixed: 8,000 | 
| Volume Resistivity: | 8 x 10^14 ohm-cm | 
| Working Time: | 45 to 60min |