ResinLab EP965 Epoxy Encapsulant Part A Black 1 gal Pail

Part number: EP965 BLACK - A GL Manufacturer SKU: EP965 BLACK A GL
ResinLab EP965 Epoxy Encapsulant Part A Black 1 gal Pail

Due to raw material shortages, this product is unavailable to purchase on the web. Please contact your Ellsworth Customer Service Representative to confirm availability and delivery time.

 

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ResinLab EP965 Black is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part A, 1 gal Pail.

ResinLab EP965 Black is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part A, 1 gal Pail.
Typical Use: Designed for medium sized castings.
Chemical Composition: Epoxy
Color: Black
Components: 2 part
Cure System: Room Temperature/Heat
Cure Time: 24h @ 25 °C; 1h @ 65 °C; 20min @ 100 °C; 15min @ 110 °C
Dielectric Strength: 410 V/mil
Elongation: 5%
Flash Point: 249 °C
Hardness: 80 D
Mix Ratio: 1:1 by volume; 1.17:1 by weight
Service Temperature: -40 to 150 °C
Shear Strength: 1,200
Specific Gravity: Part A: 1.16; Part B: 0.97; Mixed: 1.07
Tensile Strength: 8,500 psi
Thermal Conductivity: 0.1 W/mK
Viscosity: Part A: 16,000; Part B: 9,000; Mixed: 14,000
Volume Resistivity: 8 x 10^14 ohm-cm
Working Time: 15 to 20min

 

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