ResinLab EP965 Epoxy Encapsulant Part A Clear 5 gal Pail

Part number: EP965 CLEAR - A PL Manufacturer SKU: EP965 CLEAR A PL
ResinLab EP965 Epoxy Encapsulant Part A Clear 5 gal Pail
Quantity Price
1 $368.81 368.810000000 USD New Available EP965 CLEAR - A PL
2 $342.47 342.470000000 USD New Available EP965 CLEAR - A PL
3+ $320.92 320.920000000 USD New Available EP965 CLEAR - A PL
We are currently experiencing delays from this supplier. Lead times may vary as product becomes available. NON-RETURNABLE.
  • K Haz Class 9

ResinLab EP965 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part A, 5 gal Pail.

ResinLab EP965 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part A, 5 gal Pail.
Typical Use: Designed for small to medium sized castings.
Chemical Composition: Epoxy
Color: Clear
Components: 2 part
Cure System: Room Temperature/Heat
Cure Time: 24h @ 25 °C; 1h @ 65 °C; 20min @ 100 °C; 15min @ 110 °C
Dielectric Strength: 410 V/mil
Elongation: 5%
Flash Point: 252 °C
Hardness: 80 D
Mix Ratio: 1:1 by volume; 1.17:1 by weight
Service Temperature: -40 to 150 °C
Shear Strength: 1,200
Specific Gravity: Part A: 1.16; Part B: 0.98; Mixed: 1.07
Tensile Strength: 8,500 psi
Thermal Conductivity: >0.2 W/mK
Viscosity: Part A: 14,000; Part B: 8,000; Mixed: 11,000
Volume Resistivity: 6.19 x 10^15 ohm-cm
Working Time: 12min

 

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