ResinLab EP965 Epoxy Encapsulant Part B Black 1 gal Pail

Part number: EP965 BLACK - B GL Manufacturer SKU: EP965 BLACK B GL
ResinLab EP965 Epoxy Encapsulant Part B Black 1 gal Pail
Quantity Price
1 $153.27 153.270000000 USD New Available EP965 BLACK - B GL
2-8 $118.01 118.010000000 USD New Available EP965 BLACK - B GL
9+ $109.58 109.580000000 USD New Available EP965 BLACK - B GL
In Stock. Usually Ships in 1-2 Business Days.
  • A Made in the USA
  • J Haz Class 8

ResinLab EP965 Black is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part B, 1 gal Pail.

ResinLab EP965 Black is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part B, 1 gal Pail.
Typical Use: Designed for medium sized castings.
Chemical Composition: Epoxy
Color: Black
Components: 2 part
Cure System: Room Temperature/Heat
Cure Time: 24h @ 25 °C; 1h @ 65 °C; 20min @ 100 °C; 15min @ 110 °C
Dielectric Strength: 410 V/mil
Elongation: 5%
Flash Point: >100 °C
Hardness: 80 D
Mix Ratio: 1:1 by volume; 1.17:1 by weight
Service Temperature: -40 to 150 °C
Shear Strength: 1,200
Specific Gravity: Part A: 1.16; Part B: 0.97; Mixed: 1.07
Tensile Strength: 8,500 psi
Thermal Conductivity: 0.1 W/mK
Viscosity: Part A: 16,000; Part B: 9,000; Mixed: 14,000
Volume Resistivity: 8 x 10^14 ohm-cm
Working Time: 15 to 20min

 

This site uses cookies to provide you with the best possible experience. By clicking ‘Accept’, you read our Privacy Policy and consent to our terms, including the use of cookies.