ResinLab EP1121 Epoxy Encapsulant Part B Black 1 gal Pail

Part number: EP1121 BLACK B GL Manufacturer SKU: EP1121 BLACK B GL
ResinLab EP1121 Epoxy Encapsulant Part B Black 1 gal Pail
Quantity Price
1 $890.96 ($222.74 each) 890.960000000 USD New Available EP1121 BLACK B GL
2 $686.04 ($171.51 each) 686.040000000 USD New Available EP1121 BLACK B GL
3+ $637.04 ($159.26 each) 637.040000000 USD New Available EP1121 BLACK B GL
Sold as a pack (4/pk).
We are currently experiencing delays from this supplier. Lead times may vary as product becomes available. NON-RETURNABLE.
  • A Made in the USA
  • J Haz Class 8

ResinLab EP1121 Black is a two component, room temperature curing, unfilled epoxy encapsulant that is used for medium to large castings and penetrating circuitry. It has flexibility, low viscosity, good wicking, good air release, excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. Part B, 1 gal Pail.

ResinLab EP1121 Black is a two component, room temperature curing, unfilled epoxy encapsulant that is used for medium to large castings and penetrating circuitry. It has flexibility, low viscosity, good wicking, good air release, excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. Part B, 1 gal Pail.
Typical Use: Designed for small to medium sized castings requiring good thermal shock and low stress.
Chemical Composition: Epoxy
Color: Black
Components: 2 part
Cure System: Room Temperature/Heat
Cure Time: 24 to 48h @ 25 °C; 2h @ 65 °C; 30min @ 100 °C
Dielectric Strength: 410 V/mil
Elongation: 80%
Flash Point: >93 °C
Hardness: 65 D
Mix Ratio: 1:1 by volume; 1.15:1 by weight
Service Temperature: -40 to 150 °C
Shear Strength: 1,200
Specific Gravity: Part A: 1.12; Part B: 0.97; Mixed: 1.05
Tensile Strength: 1,500 psi
Thermal Conductivity: 0.1 W/mK
Viscosity: Part A: 2,500; Part B: 4,200; Mixed: 3,800
Volume Resistivity: 8 x 10^14 ohm-cm

 

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