ResinLab EP965LVLX Epoxy Encapsulant Clear 50 mL Cartridge

Part number: EP965LVLX CLEAR 50ML
ResinLab EP965LVLX Epoxy Encapsulant Clear 50 mL Cartridge
Quantity Price
1 $475.00 ($47.50 each) 475.000000000 USD New Limited Availability EP965LVLX CLEAR 50ML
2-3 $268.80 ($26.88 each) 268.800000000 USD New Limited Availability EP965LVLX CLEAR 50ML
4+ $235.20 ($23.52 each) 235.200000000 USD New Limited Availability EP965LVLX CLEAR 50ML
Sold as a pack (10/pk).
Usually Ships in 11-12 Business Weeks. Non-returnable product. Canceled orders may incur a fee at the supplier's discretion.

ResinLab EP965LVLX Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for small to medium casting, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. 50 mL Cartridge.

ResinLab EP965LVLX Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for small to medium casting, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. 50 mL Cartridge.
Typical Use: Designed for small to medium sized castings.
Chemical Composition: Epoxy
Color: Clear
Components: 2 part
Cure System: Room Temperature/Heat
Cure Time: 24h @ room temperature; 1h @ 65 °C; 20min @ 110 °C
Dielectric Strength: 410 V/mil
Elongation: 10% @ break
Hardness: 80 D
Mix Ratio: 0.96:1 by volume; 1.13:1 by weight
Service Temperature: -40 to 121 °C
Shear Strength: 1,000
Specific Gravity: Mixed: 1.08
Tensile Strength: 4,000 psi
Thermal Conductivity: 0.14 W/mK
Viscosity: Mixed: 2,650
Volume Resistivity: 7.31 x 10^14 ohm-cm

 

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