ResinLab EP965 Epoxy Encapsulant Clear 50 mL Cartridge

Part number: EP965 CLEAR 50ML
ResinLab EP965 Epoxy Encapsulant Clear 50 mL Cartridge
Quantity Price
1-6 $32.36 32.360000000 USD New Available EP965 CLEAR 50ML
7-54 $18.31 18.310000000 USD New Available EP965 CLEAR 50ML
55+ $16.02 16.020000000 USD New Available EP965 CLEAR 50ML
In Stock. Usually Ships in 1-2 Business Days.
  • A Made in the USA
  • J Haz Class 8

ResinLab EP965 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. 50 mL Cartridge.

ResinLab EP965 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. 50 mL Cartridge.
Typical Use: Designed for small to medium sized castings.
Chemical Composition: Epoxy
Color: Clear
Components: 2 part
Cure System: Room Temperature/Heat
Cure Time: 24h @ 25 °C; 1h @ 65 °C; 20min @ 100 °C; 15min @ 110 °C
Dielectric Strength: 410 V/mil
Elongation: 5%
Flash Point: Part A: 252 °C; Part B: >100 °C
Hardness: 80 D
Mix Ratio: 1:1 by volume; 1.17:1 by weight
Service Temperature: -40 to 150 °C
Shear Strength: 1,200
Specific Gravity: Part A: 1.16; Part B: 0.98; Mixed: 1.07
Tensile Strength: 8,500 psi
Thermal Conductivity: >0.2 W/mK
Viscosity: Part A: 14,000; Part B: 8,000; Mixed: 11,000
Volume Resistivity: 6.19 x 10^15 ohm-cm
Working Time: 12min

 

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