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Part number: EP1350 GL KIT
For current pricing and to place an order please contact your Ellsworth Customer Service Representative.
ResinLab EP1350 Black is a two component, low viscosity, high performing epoxy encapsulant designed for electronic potting and encapsulating. Features a very high Tg, low CTE, and superior electrical insulation properties in extreme conditions. Highly filled providing low shrinkage upon cure and high thermal conductivity. Includes a rubber toughening agent. 1 gal Kit.
| Typical Use: | Used as an electronic grade epoxy encapsulant for applications requiring superior electrical insulation in extreme conditions. |
| Chemical Composition: | Epoxy |
| Color: | Black |
| Components: | 2 part |
| Cure System: | Heat |
| Cure Time: | 2h @ 90 °C and 3h @ 150 °C and 3h @ 180 °C and 3h @ 210 °C |
| Dielectric Strength: | 425 V/mil |
| Elongation: | 10 to 15% |
| Flash Point: | Part A: >100 °C; Part B: 150 °C |
| Hardness: | 90 D |
| Mix Ratio: | 1.47:1 by volume; 3.25:1 by weight |
| Service Temperature: | -55 to 230 °C |
| Specific Gravity: | Part A: 2.52; Part B: 1.16; Mixed: 1.95 |
| Tensile Strength: | 2,500 psi |
| Thermal Conductivity: | 0.73 W/mK |
| Viscosity: | Part A: 125,000; Part B: 250; Mixed: 6,000 |
| Volume Resistivity: | 2.43 x 10^15 ohm-cm |
