ResinLab EP1350 Epoxy Encapsulant Black 1 qt Kit

Part number: EP1350 QT KIT
ResinLab EP1350 Epoxy Encapsulant Black 1 qt Kit
Quantity Price
1 $1,380.40 ($172.55 each) 1380.400000000 USD New Available EP1350 QT KIT
2 $1,062.88 ($132.86 each) 1062.880000000 USD New Available EP1350 QT KIT
3+ $986.96 ($123.37 each) 986.960000000 USD New Available EP1350 QT KIT
Sold as a pack (8/pk).
We are currently experiencing delays from this supplier. Lead times may vary as product becomes available. NON-RETURNABLE.
  • K Haz Class 9

ResinLab EP1350 Black is a two component, low viscosity, high performing epoxy encapsulant designed for electronic potting and encapsulating. Features a very high Tg, low CTE, and superior electrical insulation properties in extreme conditions. Highly filled providing low shrinkage upon cure and high thermal conductivity. Includes a rubber toughening agent. 1 qt Kit.

<p>ResinLab EP1350 Black is a two component, low viscosity, high performing epoxy encapsulant designed for electronic potting and encapsulating. Features a very high Tg, low CTE, and superior electrical insulation properties in extreme conditions. Highly filled providing low shrinkage upon cure and high thermal conductivity. Includes a rubber toughening agent. 1 qt Kit.</p>
Typical Use: Used as an electronic grade epoxy encapsulant for applications requiring superior electrical insulation in extreme conditions.
Chemical Composition: Epoxy
Color: Black
Components: 2 part
Cure System: Heat
Cure Time: 2h @ 90 °C and 3h @ 150 °C and 3h @ 180 °C and 3h @ 210 °C
Dielectric Strength: 425 V/mil
Elongation: 10 to 15%
Flash Point: Part A: >100 °C; Part B: 150 °C
Hardness: 90 D
Mix Ratio: 1.47:1 by volume; 3.25:1 by weight
Service Temperature: -55 to 230 °C
Specific Gravity: Part A: 2.52; Part B: 1.16; Mixed: 1.95
Tensile Strength: 2,500 psi
Thermal Conductivity: 0.73 W/mK
Viscosity: Part A: 125,000; Part B: 250; Mixed: 6,000
Volume Resistivity: 2.43 x 10^15 ohm-cm

 

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