ResinLab EP1026T2 Clear is a two component, room and elevated temperature curing, unfilled, epoxy adhesive paste that is used for rapid bonding of plastics, metal, and ceramics. It is semi-rigid, non-sagging, and resistant to salt spray, water, organic and inorganic solvents. 1:1 mix ratio. 50 mL Cartridge.
| Typical Use: | It was especially formulated to a 1:1 mix ratio for use in either MMD equipment or side-by-side dual cartridges for easy dispensing. | 
| Chemical Composition: | Epoxy | 
| Color: | Clear | 
| Components: | 2 part | 
| Cure System: | Room Temperature | 
| Cure Time: | 24h | 
| Dielectric Strength: | 410 V/mil | 
| Elongation: | 3 to 5% | 
| Flash Point: | >93.3 °C | 
| Hardness: | 80 D | 
| Mix Ratio: | 1:1 by volume | 
| Service Temperature: | -40 to 130 °C | 
| Specific Gravity: | Mixed: 1.16 | 
| Tack Free Time: | 20 to 30min | 
| Tensile Strength: | 7,000 psi | 
| Viscosity: | Mixed: Paste | 
| Volume Resistivity: | 8 x 10^14 ohm-cm | 
| Working Time: | 3 to 5min |