ResinLab EP1026 Epoxy Clear is a two component, room and elevated temperature curing, unfilled adhesive that is used for bonding plastics, metal, and ceramics. It is semi-rigid, free flowing, and resistant to salt spray, water, and most organic and inorganic solvents. 50 mL Cartridge.
| Typical Use: | Designed for high speed bonding of metals, ceramics, and most plastics. | 
| Chemical Composition: | Epoxy | 
| Color: | Clear | 
| Components: | 2 part | 
| Cure System: | Room Temperature | 
| Cure Time: | 24h @ room temperature | 
| Dielectric Strength: | 410 V/mil | 
| Elongation: | 10% to 20% @ break | 
| Flash Point: | Part A: 252 °C; Part B: >93 °C | 
| Hardness: | 85 D | 
| Mix Ratio: | 1:1 | 
| Service Temperature: | -40 to 90 °C | 
| Shear Strength: | 2,500 | 
| Specific Gravity: | Mixed: 1.14 | 
| Tensile Strength: | 7,500 psi | 
| Thermal Conductivity: | 0.185 W/mK | 
| Viscosity: | Mixed: 15,500 | 
| Volume Resistivity: | 8 x 10^14 ohm-cm | 
| Working Time: | 3 to 5min |