ResinLab SEC1233 Epoxy Adhesive Silver 4 mL Dual Syringe

Part number: SEC1233 4ML
ResinLab SEC1233 Epoxy Adhesive Silver 4 mL Dual Syringe
Quantity Price
1 $276.34 276.340000000 USD New Limited Availability SEC1233 4ML
2-4 $203.75 203.750000000 USD New Limited Availability SEC1233 4ML
5+ $189.20 189.200000000 USD New Limited Availability SEC1233 4ML
Usually Ships in 2-3 Business Days. Non-returnable product. Canceled orders may incur a fee at the supplier's discretion. Product must ship with ice brix via overnight service.
  • A Made in the USA
  • J Haz Class 8
  • M Time and Temperature Sensitive
  • Q Dry Ice Ice Brix Restriction

ResinLab SEC1233 Silver is a two component, room temperature curing, epoxy adhesive paste that is used for bonding electronic components. It is silver filled, thixotropic, 100% solids, protects against the environment, and has good electrical and thermal conductivity. Static mixer MKH02-12S included. 4 mL Dual Syringe.

<p>ResinLab SEC1233 Silver is a two component, room temperature curing, epoxy adhesive paste that is used for bonding electronic components. It is silver filled, thixotropic, 100% solids, protects against the environment, and has good electrical and thermal conductivity. Static mixer MKH02-12S included. 4 mL Dual Syringe.</p>
Typical Use: Resinlab SEC1233 provides excellent electrical conductivity useful in many electronic applications.
Chemical Composition: Epoxy
Color: Silver
Components: 2 part
Cure System: Room Temperature/Heat
Cure Time: 24 to 72h @ 25 °C; 1h @ 60 °C
Elongation: 20% to 30% @ break
Flash Point: Part A: >93 °C; Part B: 100 °C
Hardness: 70 D
Mix Ratio: 1:1 by volume; 1:1 by weight
Service Temperature: -40 to 150 °C
Shear Strength: 600
Specific Gravity: Part A: 3.88; Part B: 3.97
Tensile Strength: 450 psi
Thermal Conductivity: 4.65 W/mK
Viscosity: Mixed: 29,500 to 582,000
Volume Resistivity: 0.0016 ohm-cm

 

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