ResinLab SEC1233 Epoxy Adhesive Silver 4 g Packet

Part number: SEC1233 4 GRAM Manufacturer SKU: SEC1233 4GR
ResinLab SEC1233 Epoxy Adhesive Silver 4 g Packet

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ResinLab SEC1233 Silver is a two component, room temperature curing, epoxy adhesive paste that is used for bonding electronic components. It is silver filled, thixotropic, 100% solids, protects against the environment, and has good electrical and thermal conductivity. 4 g Packet.

ResinLab SEC1233 Silver is a two component, room temperature curing, epoxy adhesive paste that is used for bonding electronic components. It is silver filled, thixotropic, 100% solids, protects against the environment, and has good electrical and thermal conductivity. 4 g Packet.
Typical Use: Electronic applications, "cold solder."
Chemical Composition: Epoxy
Color: Silver
Components: 2 part
Cure System: Room Temperature/Heat
Cure Time: 24 to 72h @ 25 °C; 1h @ 60 °C
Elongation: 20 to 30% @ break
Flash Point: Part A: >93 °C; Part B: 100 °C
Hardness: 70 D
Mix Ratio: 1:1 by volume; 1:1 by weight
Service Temperature: -40 to 150 °C
Shear Strength: 600
Specific Gravity: Part A: 3.88; Part B: 3.97
Tensile Strength: 450 psi
Thermal Conductivity: 4.65 W/mK
Viscosity: Mixed: 29,500 to 582,000
Volume Resistivity: 0.0016 ohm-cm

 

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