Dow DOWSIL™ 1-4174 Thermally Conductive Adhesive Gray is a one component, solvent free, silicone polymer that is used for bonding electronic components, housings, lids, base plates, and heat sinks. It is heat curing, self-leveling, flowable, high tensile strength, and allows controlled bond line thickness. 1.5 kg Cartridge.
| Typical Use: | Bonding integrated circuit substrates; adhering lids and housings; attaching base plates and heat sinks. |
| Brand: | DOWSIL |
| Color: | Gray |
| Components: | 1 part |
| Cure Time: | 90min @ 100 °C; 30min @ 125 °C; 20min @ 150 °C |
| Dielectric Strength: | 16.7 kV/mm |
| Elongation: | 22% |
| Flash Point: | >100 °C |
| Hardness: | 92 A |
| Service Temperature: | -45 to 200 °C |
| Shear Strength: | 590 |
| Specific Gravity: | 2.7 @ 25 °C |
| Tensile Strength: | 900 psi |
| Thermal Conductivity: | 1.9 W/mK @ 25 °C |
| Viscosity: | 58,000 |
| Volume Resistivity: | 1.9e + 14 ohm-cm |