ResinLab EP965T1 Epoxy Encapsulant Black 50 mL Cartridge

Part number: EP965T1 BLACK 50ML
ResinLab EP965T1 Epoxy Encapsulant Black 50 mL Cartridge
Quantity Price
1 $1,730.22 ($173.02 each) 1730.220000000 USD New Limited Availability EP965T1 BLACK 50ML
2-9 $1,332.57 ($133.26 each) 1332.570000000 USD New Limited Availability EP965T1 BLACK 50ML
10+ $1,239.10 ($123.91 each) 1239.100000000 USD New Limited Availability EP965T1 BLACK 50ML
Sold as a pack (10/pk).
  • Item usually ships in 10-14 business days
  • Item is noncancelable and nonreturnable

ResinLab EP965T1 Black is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. 50 mL Cartridge.

ResinLab EP965T1 Black is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. 50 mL Cartridge.
Typical Use: Designed for medium sized castings.
Chemical Composition: Epoxy
Color: Black
Components: 2 part
Cure System: Room Temperature/Heat
Cure Time: 24h @ room temperature; 1h @ 65 °C; 20min @ 100 °C
Dielectric Strength: 410 V/mil
Elongation: 0% to 2% @ break
Flash Point: Part A: >249 °C; Part B: >100 °C
Hardness: 80 D
Mix Ratio: 1:1 by volume; 100:85 by weight
Service Temperature: -40 to 150 °C
Shear Strength: 1,500
Specific Gravity: Mixed: 1.07
Tensile Strength: 8,500 psi
Thermal Conductivity: 0.178 W/mK
Viscosity: Mixed: 165,000
Volume Resistivity: 8 x 10^14 ohm-cm
Working Time: 15 to 20min

 

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