ResinLab EP691 Epoxy Encapsulant Clear 50 mL Cartridge

Part number: EP691 CLEAR 50ML
ResinLab EP691 Epoxy Encapsulant Clear 50 mL Cartridge

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ResinLab EP691 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. 50 mL Cartridge.

ResinLab EP691 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. 50 mL Cartridge.
Typical Use: Designed for medium sized castings requiring good clarity.
Chemical Composition: Epoxy
Color: Clear
Components: 2 part
Cure System: Room Temperature/Heat
Cure Time: 24h @ room temperature; 1h @ 65 °C; 20min @ 100 °C
Dielectric Strength: 410 V/mil
Elongation: 4% to 9% @ break
Flash Point: Part A: 252 °C; Part B: >260 °C
Hardness: 80 D
Mix Ratio: 2:1 by volume; 100:45 by weight
Service Temperature: -40 to 121 °C
Specific Gravity: Mixed: 1.11
Tensile Strength: 8,500 psi
Thermal Conductivity: 0.14 W/mK
Viscosity: Mixed: 9,000
Volume Resistivity: 8 x 10^14 ohm-cm
Working Time: >2h

 

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