ResinLab EP1121 Epoxy Encapsulant Part A Clear 1 gal Pail

Part number: EP1121 CLEAR A GL
ResinLab EP1121 Epoxy Encapsulant Part A Clear 1 gal Pail
Quantity Price
1 $710.08 ($177.52 each) 710.080000000 USD New Available EP1121 CLEAR A GL
2 $546.76 ($136.69 each) 546.760000000 USD New Available EP1121 CLEAR A GL
3+ $507.72 ($126.93 each) 507.720000000 USD New Available EP1121 CLEAR A GL
Sold as a pack (4/pk).
Usually Ships in 2-3 Business Days. NON-RETURNABLE.
  • A Made in the USA
  • K Haz Class 9

ResinLab EP1121 Clear is a two component, room temperature curing, unfilled epoxy encapsulant that is used for medium to large castings and penetrating circuitry. It has flexibility, low viscosity, good wicking, good air release, excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. Part A, 1 gal Pail.

ResinLab EP1121 Clear is a two component, room temperature curing, unfilled epoxy encapsulant that is used for medium to large castings and penetrating circuitry. It has flexibility, low viscosity, good wicking, good air release, excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. Part A, 1 gal Pail.
Typical Use: Designed for small to medium sized castings.
Chemical Composition: Epoxy
Color: Clear
Components: 2 part
Cure System: Room Temperature/Heat
Cure Time: 24 to 48h @ 25 °C; 2h @ 65 °C; 30min @ 100 °C
Dielectric Strength: 410 V/mil
Elongation: 80%
Flash Point: >93 °C
Hardness: 65 D
Mix Ratio: 1.05:1 by volume; 1.20:1 by weight
Service Temperature: -40 to 150 °C
Shear Strength: 1,200
Specific Gravity: 1.11; Part B: 0.96; Mixed: 1.04
Tensile Strength: 1,500 psi
Thermal Conductivity: 0.1 W/mK
Viscosity: Part A: 2,500; Part B: 4,200; Mixed: 3,800
Volume Resistivity: 8 x 10^14 ohm-cm
Working Time: 20min

 

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