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Part number: EP1026 CLEAR B GL
ResinLab EP1026 Clear is a two component, room and elevated temperature curing, unfilled adhesive that is used for bonding plastics, metal, and ceramics. It is semi-rigid, free flowing, and resistant to salt spray, water, and most organic and inorganic solvents. 1:1 mix ratio. Part B, 1 gal Pail.
| Typical Use: | Designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free flowing in viscosity. It gives good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. |
| Chemical Composition: | Epoxy hardener |
| Color: | Clear |
| Components: | 2 part |
| Cure System: | Room Temperature |
| Cure Time: | 24h @ room temperature |
| Dielectric Strength: | 410 V/mil |
| Elongation: | 10% to 20% @ break |
| Flash Point: | >93 °C |
| Hardness: | 85 D |
| Mix Ratio: | 1:1 by volume; 1:1 by weight |
| Service Temperature: | -40 to 90 °C |
| Shear Strength: | 2,500 |
| Specific Gravity: | Part B: 1.12; Mixed: 1.14 |
| Tensile Strength: | 7,500 psi |
| Thermal Conductivity: | 0.185 W/mK |
| Viscosity: | Part B: 15,000; Mixed: 15,500 |
| Volume Resistivity: | 8 x 10^14 ohm-cm |
| Working Time: | 3 to 5min |
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$803.08 ($200.77 each)Sold as a pack (4/pk).Display Quantity PricingPart #: EP1026 CLEAR A GL