Dow DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler 720 g Kit

Part number: TC-5515 LT GAP FILLER 720G KIT Manufacturer SKU: 99151387
Dow DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler 720 g Kit
Quantity Price
1-2 $71.03 71.030000000 USD New Limited Availability TC-5515 LT GAP FILLER 720G KIT
3-18 $55.05 55.050000000 USD New Limited Availability TC-5515 LT GAP FILLER 720G KIT
19+ $50.79 50.790000000 USD New Limited Availability TC-5515 LT GAP FILLER 720G KIT
Usually Ships in 5-6 Business Weeks. NON-RETURNABLE.

Dow DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler is a two component, silicone material that is used to dissipate heat from electronic devices, EV modules, and other heat-generating components. It is non-flowable and cures at room temperature or heat accelerated. 720 g Kit.

<p>Dow DOWSIL&trade; TC-5515 LT Low Density Thermally Conductive Gap Filler is a two component, silicone material that is used to dissipate heat from electronic devices, EV modules, and other heat-generating components. It is non-flowable and cures at room temperature or heat accelerated. 720 g Kit.</p>
Typical Use: Used to provide reliable cooling performance.
Brand: DOWSIL
Chemical Composition: Silicone
Color: Part A: White; Part B: Blue
Components: 2 part
Cure System: Room Temperature
Cure Time: 360 min @ 25 °C; 30 min @ 80 °C
Dielectric Strength: 19 kV/mm
Hardness: 65 OO
Key Specifications: UL 94 V0
Mix Ratio: 1:1
Service Temperature: -40 to 150 °C
Specific Gravity: 1.95
Thermal Conductivity: 1.7 W/mK
Viscosity: Part A: 150; Part B: 120; Mixed: 140
Working Time: 90 min @ 25 °C

 

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