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Part number: EE-3200 PART B .5KG
Manufacturer SKU: 4121013
Dow DOWSIL™ EE-3200 Low Stress Silicone Encapsulant is a two component, low viscosity encapsulant with a 1:1 mix ratio, good heat dissipation, and good thermal conductivity. Once thoroughly mixed, the mixture will cure to a flexible elastomer for the protection of electronic and electrical components. Part B, 0.5 kg Jar.
| Typical Use: | Used as a low stress encapsulant to lessen internal stress generation, improve manufacturing speed, and fill small gaps on electronic devices. EE-3200 can be used on automotive electronics modules, junction boxes, and power conversion devices. |
| Brand: | DOWSIL |
| Chemical Composition: | Polydimethylsiloxane |
| Color: | Black |
| Components: | 2 part |
| Cure System: | Room Temperature/Heat |
| Cure Time: | 3h @ 25 °C; 20min @ 50 °C |
| Dielectric Strength: | 350 V/m |
| Elongation: | 340% |
| Flash Point: | 98 °C |
| Hardness: | 20 OO |
| Mix Ratio: | 1:1 |
| Specific Gravity: | 1.48 |
| Tensile Strength: | 33 psi |
| Thermal Conductivity: | 0.5 W/mK |
| Viscosity: | 2,000 |
| Volume Resistivity: | 1e + 15 ohm-cm |
| Working Time: | 30min @ 25 °C |
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$142.81Display Quantity PricingPart #: EE-3200 PART A .5KG