Print
Email
Please contact your Ellsworth Customer Service Representative to confirm availability and delivery time.
AI Technology ME8452-A is an accelerated version of ME8452 for snapcuring applications. This innovative silver-filled epoxy paste adhesive is solvent free, reworkable, and electrically and thermally conductive. With outstanding flexibility for bonding materials with highly mismatched CTE's (i.e. alumina to aluminum, silicon to copper). ME8452-A can be easily reworked from 80 to 100 ºC and is fitting for applications such as large area die attach and substrate attach because of its ability to bond materials with highly mismatched CTE's. Both viscosity and thixotropic index can be modified to your exact needs. ME8452-A is available in syringes for automatic needle dispensing applications or in jars. 1 cc TSI Syringe.
| Typical Use: | Ideal for snap curing, large area die, automated assembly, mismatched CTE's, and re-workability. |
| Chemical Composition: | Silver |
| Components: | 1 part |
| Cure System: | Heat |
| Cure Time: | 2h @ 100 °C; 1h @ 125 °C; 30min @ 150 °C |
| Hardness: | 80 A |
| Shear Strength: | 1,000 |
| Specific Gravity: | 3.3 |
| Thermal Conductivity: | 7.9 W/mC |
| Viscosity: | 255,000 |
