AI Technology PRIMA-SOLDER ME8452-A Epoxy Paste Adhesive 1 cc TSI Syringe

Part number: ME8452-A 1CC TSI SYRINGE
AI Technology PRIMA-SOLDER ME8452-A Epoxy Paste Adhesive 1 cc TSI Syringe

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AI Technology ME8452-A is an accelerated version of ME8452 for snapcuring applications. This innovative silver-filled epoxy paste adhesive is solvent free, reworkable, and electrically and thermally conductive. With outstanding flexibility for bonding materials with highly mismatched CTE's (i.e. alumina to aluminum, silicon to copper). ME8452-A can be easily reworked from 80 to 100 ºC and is fitting for applications such as large area die attach and substrate attach because of its ability to bond materials with highly mismatched CTE's. Both viscosity and thixotropic index can be modified to your exact needs. ME8452-A is available in syringes for automatic needle dispensing applications or in jars. 1 cc TSI Syringe.

<p>AI Technology ME8452-A is an accelerated version of ME8452 for snapcuring applications. This innovative silver-filled epoxy paste adhesive is solvent free, reworkable, and electrically and thermally conductive. With outstanding flexibility for bonding materials with highly mismatched CTE's (i.e. alumina to aluminum, silicon to copper). ME8452-A can be easily reworked from 80 to 100 ºC and is fitting for applications such as large area die attach and substrate attach because of its ability to bond materials with highly mismatched CTE's. Both viscosity and thixotropic index can be modified to your exact needs. ME8452-A is available in syringes for automatic needle dispensing applications or in jars. 1 cc TSI Syringe.</p>
Typical Use: Ideal for snap curing, large area die, automated assembly, mismatched CTE's, and re-workability.
Chemical Composition: Silver
Components: 1 part
Cure System: Heat
Cure Time: 2h @ 100 °C; 1h @ 125 °C; 30min @ 150 °C
Hardness: 80 A
Shear Strength: 1,000
Specific Gravity: 3.3
Thermal Conductivity: 7.9 W/mC
Viscosity: 255,000

 

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