When: Wednesday, May 06, 2026 09:00 AM - Thursday, May 07, 2026 03:00 PM Central Time
Where: Baird Center, Milwaukee, WI
Description:
MoldMan Systems™, a company of Ellsworth Adhesives, will be attending the Electrical Wire Processing Technology Expo (Booth #1309) May 6-7, 2026, at the Baird Center in Milwaukee, WI. Stop by to see a demonstration of the MoldMan 1050 doing an on-site demonstration of low-pressure molding (LPM) of a wire splice application.
Booth Highlights
- Protection for Wire Splicing and Harnessing – Customizable machines allow for encapsulation around splice and harness points for wire organization.
- In-Booth Demonstration – Watch a demonstration of the MoldMan 1050 encapsulating a wire splice application..
- Protect Electronic Devices – Low-pressure molding (LPM) protects sensitive electronics from heat, water, dust, and stress
