Bergquist Gap Pad VO High Thermal Fiberglass Pad offers conformability, electrical insulation, and tear resistance. The material has tack on one side and is used to manage heat and fill air gaps in printed circuit boards and electronic assemblies. 8 in x 16 in x 0.250 in thick.
Typical Use: | Used to manage heat and to fill air gaps in printed circuit boards and electronic assemblies. |
Brand: | Gap Pad |
Chemical Composition: | Fiberglass |
Color: | Gold Pink |
Components: | 1 part |
Hardness: | 40 OO |
Thermal Conductivity: | 0.8 W/mK |
Volume Resistivity: | 10^11 ohm-meter |