Similar to thermally conductive adhesives, thermally conductive encapsulants are designed to dissipate heat as part of the assembly of heat-generating components. Thermally conductive encapsulants might be used for gap filling between heat sources and heat sinks, high-voltage transformer and sensor potting, assembling substrates to heat sinks, and other applications that require thermal management. Ellsworth Adhesives provides thermally conductive encapsulants from top suppliers like Henkel Loctite, ResinLab, Parker LORD, Dow, and ELANTAS PDG. Choose from one and two part formulations.