Bergquist Gap Filler 3500S35 Thermally Conductive Adhesive is a two component, liquid gap filling material that is used to fill air gaps for fragile electronic components. It cures at room or elevated temperatures and has low viscosity, good thixotropic characteristics and conformability. Gap Filler 3500S35 is not designed to be a structural adhesive. 1200 cc Kit.
Typical Use: | Used to fill air gaps for fragile electronic components. |
Brand: | Gap Filler |
Color: | Part A: White; Part B: Blue |
Components: | 2 part |
Cure System: | room temperature/heat |
Cure Time: | 15h @ 25 °C and 30min @ 100 °C |
Dielectric Strength: | 275 V/mil |
Hardness: | 35 OO |
Mix Ratio: | 1:1 |
Thermal Conductivity: | 3.6 W/mK |
Viscosity: | Mixed: 150,000 |
Volume Resistivity: | 10^9 ohm-meter |
Working Time: | 60min @ 25 °C |