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Part number: ME-543 10CC EFD (8GM)
Manufacturer SKU: 3019484
Parker Lord CoolTherm® ME-543 Black is a thermally conductive, anhydride-free, semiconductor grade epoxy underfill designed for encapsulating densely populated area array flip chip devices. Able to handle over-molding processes. Fast cure, jettable, self-filleting, and can withstand 260 °C peak reflow temperatures of lead-free solders. 10 cc Syringe.
| Typical Use: | Used for encapsulating densely populated area array flip chip devices. |
| Brand: | CoolTherm |
| Chemical Composition: | Epoxy resin |
| Color: | Black |
| Components: | 1 part |
| Cure System: | Heat |
| Cure Time: | 7 to 20min @ 160 to 165 °C |
| Flash Point: | ≥93 °C |
| Specific Gravity: | 2.2 |
| Thermal Conductivity: | 1.2 W/mK |
| Viscosity: | 21,000 |
| Volume Resistivity: | 1 x 10^15 ohm-cm |
