HumiSeal® 2C51 Silicone High Strength Encapsulating Gel is a two component, fast-curing silicone encapsulating gel for printed circuit board applications. It is also used as a conformal coating for electronics. A room temperature cure, low viscosity and UV tracer allows for ease of application and inspection. 1:1 mix ratio. Part B, 1 L Can.
| Typical Use: | Used for general printed circuit board applications. | 
| Chemical Composition: | Silicone | 
| Color: | Black | 
| Components: | 2 part | 
| Cure System: | Room Temperature/Heat | 
| Cure Time: | 30 minutes @ 70°C; 60 min @ room temperature | 
| Flash Point: | >100 °C | 
| Hardness: | 45 to 55 OO | 
| Mix Ratio: | 1:1 | 
| Specific Gravity: | 0.97 | 
| Viscosity: | 500 | 
| Volume Resistivity: | 5.2 x 10^13 ohm-cm |