HumiSeal® 2C51 Silicone High Strength Encapsulating Gel is a two component, fast-curing silicone encapsulating gel for printed circuit board applications. It is also used as a conformal coating for electronics. A room temperature cure, low viscosity and UV tracer allows for ease of application and inspection. 1:1 mix ratio. Part A, 1 L Can.
| Typical Use: | Used for general printed circuit board applications. |
| Chemical Composition: | Silicone |
| Color: | Yellow |
| Components: | 2 part |
| Cure System: | Room Temperature/Heat |
| Cure Time: | 30 minutes @ 70°C; 60 min @ room temperature |
| Flash Point: | >100 °C |
| Hardness: | 45 to 55 OO |
| Mix Ratio: | 1:1 |
| Specific Gravity: | 0.97 |
| Viscosity: | 250 |
| Volume Resistivity: | 5.2 x 10^13 ohm-cm |