Dow DOWSIL™ 93-500 Thixotropic Space Grade Encapsulant Clear 115 g Kit

Part number: 93-500 THIXOTROPIC 115G Manufacturer SKU: 2410613
Dow DOWSIL™ 93-500 Thixotropic Space Grade Encapsulant Clear 115 g Kit
Quantity Price
1 $1,304.04 1304.040000000 USD New Available 93-500 THIXOTROPIC 115G
2 $1,187.76 1187.760000000 USD New Available 93-500 THIXOTROPIC 115G
3+ $1,113.00 1113.000000000 USD New Available 93-500 THIXOTROPIC 115G
In Stock. We are currently experiencing delays from this supplier. Lead times may vary as product becomes available.
  • A Made in the USA

Dow DOWSIL™ 93-500 Thixotropic Space Grade Encapsulant and 93-500 Space Grade Encapsulant Clear are two component, silicone elastomers that are used for aerospace applications such as sealing optical sensors, encapsulating/potting electronic components, and bonding solar cells to substrates, OSR mirrors to substrates, or cover glasses to solar cells. It offers a wide service temperature range, electrical stability, and meets NASA requirements for low thermal vacuum outgassing. 115 g Kit.

<p>Dow DOWSIL™ 93-500 Thixotropic Space Grade Encapsulant and 93-500 Space Grade Encapsulant Clear are two component, silicone elastomers that are used for aerospace applications such as sealing optical sensors, encapsulating/potting electronic components, and bonding solar cells to substrates, OSR mirrors to substrates, or cover glasses to solar cells. It offers a wide service temperature range, electrical stability, and meets NASA requirements for low thermal vacuum outgassing. 115 g Kit.</p>
Typical Use: Adhering/bonding applications such as solar cells to substrates, cover glasses to solar cells, OSR mirrors to substrates, electronic subcomponents and sub- assemblies, optical and other sensors.
Brand: DOWSIL
Color: Clear
Components: 2 part
Cure Time: 2h @ 65 °C; 30min @ 100 °C; 10min @ 150 °C
Dielectric Strength: 460 V/mil
Elongation: 125%
Hardness: 60 A
Mix Ratio: 10:1 by weight
Service Temperature: -115 to 200 °C
Shear Strength: 475
Specific Gravity: 1.08
Tack Free Time: <16h
Tensile Strength: 1,225 psi
Thermal Conductivity: 0.2 W/mC
Viscosity: Non-slump
Volume Resistivity: 6.2 x 10^14 ohm-cm
Working Time: 0.9h

 

This site uses cookies

We use cookies to provide you with the best possible experience. By using this site, you accept our terms of service and use of cookies.