ResinLab EP1112NC Epoxy Encapsulant Part B Clear 5 gal Pail

Part number: EP1112NC CLEAR - B PL Manufacturer SKU: EP1112NC CLEAR B PL
ResinLab EP1112NC Epoxy Encapsulant Part B Clear 5 gal Pail

For current pricing and to place an order please contact your Ellsworth Customer Service Representative.

Call Us

Call Us
Contact customer service at 877-454-9224.

Email Us

Email Us
Email us for product availability.

 

ResinLab EP1112NC Clear is a two component, room temperature curing, unfilled epoxy encapsulant that is used for small to medium sized castings and penetrating circuitry. It is electronic grade, low viscosity, flexible, good wicking, gives good air release, and has excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. Part B, 5 gal Pail.

ResinLab EP1112NC Clear is a two component, room temperature curing, unfilled epoxy encapsulant that is used for small to medium sized castings and penetrating circuitry. It is electronic grade, low viscosity, flexible, good wicking, gives good air release, and has excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. Part B, 5 gal Pail.
Typical Use: Its low viscosity allows for good wicking and penetration into components and circuitry and also gives good air release.
Chemical Composition: Epoxy
Color: Clear
Components: 2 part
Cure System: Room Temperature
Cure Time: 6 to 12h @ room temperature; 1h @ 65 °C; 10min @ 100 °C
Dielectric Strength: 410 V/mil
Elongation: 45% @ break
Flash Point: >93 °C
Hardness: 70 D
Mix Ratio: 1:1 by volume; 1.20:1 by weight
Service Temperature: -40 to 121 °C
Specific Gravity: Part B: 0.96; Mixed: 1.05
Tensile Strength: 3,000 psi
Thermal Conductivity: 0.14 W/mK
Viscosity: Part B: 795; Mixed: 1,000
Volume Resistivity: 3.37 x 10^14 ohm-cm

 

This site uses cookies

We use cookies to provide you with the best possible experience. By using this site, you accept our terms of service and use of cookies.