Henkel Loctite STYCAST 1090 Epoxy Black 5 lb Pail

Part number: 1090 STYCAST 5 LB. Manufacturer SKU: 1187951
Henkel Loctite STYCAST 1090 Epoxy Black 5 lb Pail

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Henkel Loctite STYCAST 1090 Epoxy Encapsulant Black, formerly Emerson and Cuming, is used for potting and encapsulating electronic components and aerospace applications that need low weight. It is a syntactic foam that offers low density, low dielectric constant, and low coefficient of thermal expansion. 5 lb Pail.

<p>Henkel Loctite STYCAST 1090 Epoxy Encapsulant Black, formerly Emerson and Cuming, is used for potting and encapsulating electronic components and aerospace applications that need low weight. It is a syntactic foam that offers low density, low dielectric constant, and low coefficient of thermal expansion. 5 lb Pail.</p>
Typical Use: Used for encapsulation and potting of electronic assemblies that require lower weight such as aerospace applications.
Brand: STYCAST
Chemical Composition: Epoxy
Color: Black
Components: 2 part
Cure System: Room Temperature/Heat
Cure Time: Catalyst 9: 16 to 24h @ 25 °C; Catalyst 11: 8 to 16h @ 80 °C; Catalyst 23LV: 24h @ 25 °C
Dielectric Strength: Catalyst 11: 14.8 kV/mm
Flash Point: >93.3 °C
Hardness: Catalyst 9: 80 D; Catalyst 11: 82 D; Catalyst 23LV: 75 D
Mix Ratio: Catalyst 9: 100:7 by volume, 100:9 by weight; Catalyst 11: 100:7.5 by volume, 100:10.5 by weight; Catalyst 23LV: 100:14.5 by volume, 100:18.5 by weight
Service Temperature: Catalyst 9: -40 to 130 °C; Catalyst 11: -55 to 155 °C; Catalyst 23LV: -65 to 105 °C
Specific Gravity: 0.7
Tensile Strength: Catalyst 9: 3,000 psi; Catalyst 11: 4,700 psi; Catalyst 23LV: 3,900 psi
Thermal Conductivity: Catalyst 9: 0.19 W/mK; Catalyst 11: 0.19 W/mK; Catalyst 23LV: 0.19 W/mK
Viscosity: Catalyst 9: 30,000; Catalyst 11: 29,000; Catalyst 23LV: 5,000
Volume Resistivity: Catalyst 9: >1 x 10^13 ohm-cm; Catalyst 11: >1 x 10^13 ohm-cm; Catalyst 23LV: >1 x 10^13 ohm-cm
Working Time: Catalyst 9: 45min; Catalyst 11: >4h; Catalyst 23LV: 60min

 

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