Henkel Loctite STYCAST 1090 Epoxy Encapsulant Black, formerly Emerson and Cuming, is used for potting and encapsulating electronic components and aerospace applications that need low weight. It is a syntactic foam that offers low density, low dielectric constant, and low coefficient of thermal expansion. 5 lb Pail.
| Typical Use: | Used for encapsulation and potting of electronic assemblies that require lower weight such as aerospace applications. |
| Brand: | STYCAST |
| Chemical Composition: | Epoxy |
| Color: | Black |
| Components: | 2 part |
| Cure System: | Room Temperature/Heat |
| Cure Time: | Catalyst 9: 16 to 24h @ 25 °C; Catalyst 11: 8 to 16h @ 80 °C; Catalyst 23LV: 24h @ 25 °C |
| Dielectric Strength: | Catalyst 11: 14.8 kV/mm |
| Flash Point: | >93.3 °C |
| Hardness: | Catalyst 9: 80 D; Catalyst 11: 82 D; Catalyst 23LV: 75 D |
| Mix Ratio: | Catalyst 9: 100:7 by volume, 100:9 by weight; Catalyst 11: 100:7.5 by volume, 100:10.5 by weight; Catalyst 23LV: 100:14.5 by volume, 100:18.5 by weight |
| Service Temperature: | Catalyst 9: -40 to 130 °C; Catalyst 11: -55 to 155 °C; Catalyst 23LV: -65 to 105 °C |
| Specific Gravity: | 0.7 |
| Tensile Strength: | Catalyst 9: 3,000 psi; Catalyst 11: 4,700 psi; Catalyst 23LV: 3,900 psi |
| Thermal Conductivity: | Catalyst 9: 0.19 W/mK; Catalyst 11: 0.19 W/mK; Catalyst 23LV: 0.19 W/mK |
| Viscosity: | Catalyst 9: 30,000; Catalyst 11: 29,000; Catalyst 23LV: 5,000 |
| Volume Resistivity: | Catalyst 9: >1 x 10^13 ohm-cm; Catalyst 11: >1 x 10^13 ohm-cm; Catalyst 23LV: >1 x 10^13 ohm-cm |
| Working Time: | Catalyst 9: 45min; Catalyst 11: >4h; Catalyst 23LV: 60min |