Henkel Loctite ECCOBOND E 1216M is an epoxy, fast-flowing capillary underfill encapsulant that is used for high volume assemblies. It fully cures in a single reflow cycle and provides excellent stability, adhesion, and strength. 30 cc Syringe.
| Typical Use: | Used as a fast, void-free underfill of area array devices. |
| Brand: | ECCOBOND |
| Chemical Composition: | Epoxy resin |
| Color: | Black |
| Components: | 1 part |
| Cure System: | Heat |
| Cure Time: | 3min @ 165 °C; 4min @ 150 °C; 10min @ 130 °C |
| Dielectric Strength: | 42 kV/mm |
| Flash Point: | >100 °C |
| Hardness: | 86 D |
| Specific Gravity: | 1.4 |
| Thermal Conductivity: | 0.42 W/mK |
| Viscosity: | 4,000 |
| Volume Resistivity: | 2.82 x 10^16 ohm-cm |