Henkel Loctite Ablestik 84-1LMI Epoxy Die Attach Adhesive Silver is used for microelectronic chip bonding applications. It offers low bleed, low outgassing, and is electrically conductive. 10 cc Syringe.
| Typical Use: | Used for microelectronic chip bonding applications. |
| Brand: | Ablestik |
| Color: | Silver |
| Components: | 1 part |
| Cure System: | Heat |
| Cure Time: | 1h @ 150 °C |
| Flash Point: | >93 °C |
| Specific Gravity: | 3.4 to 3.5 |
| Thermal Conductivity: | 2.4 W/mK |
| Viscosity: | 30,000 |