AI Technology Prima-Solder ME8456 Epoxy Paste Adhesive is a thermally conductive, electrically, reworkable, pure silver filled epoxy paste adhesive. It is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials with highly mismatched CTE's. 1 cc Syringe.
Typical Use: | Ideal for snap curing, large area die, automated assembly, mismatched CTE's, and re-workability. |
Color: | Silver |
Components: | 1 part |
Cure Time: | 4h @ 100 °C; 8h @ 80 °C |
Hardness: | 80 A |
Shear Strength: | 1000 |
Specific Gravity: | 3.5 |
Thermal Conductivity: | 7.9 W/mC |
Viscosity: | 130,000 |