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Please contact your Ellsworth Customer Service Representative to confirm availability and delivery time.
AI Technology EG8050-E is an electrically conductive, silver filled epoxy paste adhesive. It exhibits excellent flexibility for bonding materials with highly mismatched CTE's (i.e. alumina to aluminum, silicon to copper). EG8050-E can be readily reworked at 80 to 100 ºC and is fitting for applications such as large area die attach and substrate attach because of its capability to bond materials with highly mismatched CTE's. Both viscosity and thixotropic index can be modified to your specific needs. EG8050-E is available in syringes for automatic needle dispensing applications or in jars. EG8050-E can be premixed and frozen. Premixed 3 cc EFD Syringe.
| Typical Use: | Ideal for large area die, re-workability, mismatched CTE's and solder replacement. |
| Chemical Composition: | Silver |
| Components: | 1 or 2 part |
| Cure System: | Room Temperature/Heat |
| Cure Time: | 120h @ 25 °C; 8h @ 80 °C; 2h @ 125 °C; 1h @ 150 °C |
| Hardness: | 80 A |
| Service Temperature: | 80 to 100 °C |
| Shear Strength: | 600 |
| Specific Gravity: | 3.3 |
| Thermal Conductivity: | 7.9 W/mC |
| Viscosity: | 180,000 |
