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AI Technology EG7655 is an alumina filled, reworkable, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e. alumina to aluminum, silicon to copper). EG7655's high thermal conductivity and flexibility make it ideal for bonding large area substrates, components and heat sinks where thermal management is critical. EG7655 exhibits reduced bond strength at 80 to 100 ºC for simple rework. Once cured the adhesive is flexible with 80 A hardness and tensile elongation of more than 30%. EG7655 is available in syringes for automatic needle dispensing applications or in jars. Upon request, the adhesive can be shipped premixed and frozen. 2 oz Kit.
| Typical Use: | Ideal for heat-sink attaching, substrate and component attaching, large area bonding, and bonding mismatched CTE's. |
| Chemical Composition: | Alumina |
| Components: | 2 part |
| Cure System: | Room Temperature/Heat |
| Cure Time: | 120h @ 25 °C; 4h @ 100 °C; 1h @ 150 °C |
| Dielectric Strength: | >750 V/mil |
| Mix Ratio: | 1:1 by weight |
| Service Temperature: | 80 to 100 °C |
| Shear Strength: | 1,000 |
| Specific Gravity: | Part A: 2; Part B: 2.2 |
| Thermal Conductivity: | 1.7 W/mC |
| Viscosity: | 280,000 |
