Dow DOWSIL™ ME-1070 Silicone Die Attach Adhesive Black is a one component, heat curing, microelectronics adhesive that provides high temperature stability, stress relief, seals packaging, and bonds with a variety of substrates. It offers unprimed adhesion, high strength, flowability, low modulus, and low levels of ionic impurities. 30 g Tube.
| Typical Use: | Used for microelectronic devices that require low modulus materials, lead-free solder reflow temperatures, or other high-reliability applications. |
| Brand: | DOWSIL |
| Color: | Black |
| Components: | 1 part |
| Cure System: | Heat |
| Cure Time: | 30min @ 125 °C; 60min @ 150 °C |
| Flash Point: | >182.2 °C |
| Hardness: | 71 A |
| Shear Strength: | 1,000 |
| Specific Gravity: | 1.2 @ 25 °C |
| Viscosity: | 18,000 |
| Working Time: | >24h @ 25 °C |