Bostik Thermelt 865 Hot Melt Adhesive Black is a polyamide resin with excellent adhesion and good brittleness resistance at low temperatures. Non reactive and solvent free. 44 lb Case.
Typical Use: | Used for low pressure molding of electronic/electric components, connectors and cables. |
Brand: | Thermelt |
Color: | Black |
Components: | 1 part |
Cure System: | Room Temperature |
Elongation: | >200% |
Flash Point: | >204.4 °C |
Hardness: | 31 D |
Hot Melt Type: | Pellets & Pillows |
Service Temperature: | -55 to 120 °C |
Tensile Strength: | 435.1 psi |
Thermal Conductivity: | 0.2 W/mK @ 23 °C; 0.6 W/mK @ 180 °C |
Viscosity: | 3000 @ 210 °C |