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Part number: EP750 BLACK - B PL
For current pricing and to place an order please contact your Ellsworth Customer Service Representative.
ResinLab EP750 Black is a two component, room temperature or heat curing, unfilled, epoxy structural adhesive that is used for bonding with most materials and filling voids. It is semi-rigid, free flowing, and has good wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part B, 5 gal Pail.
| Typical Use: | This product has good wetting and adhesion to most surfaces. This product has a free flowing viscosity. It has very good resistance to water, acids and bases and most organic solvents. |
| Chemical Composition: | Part B: Polyamide blend |
| Color: | Black |
| Components: | 2 part |
| Cure System: | Heat |
| Cure Time: | 24 to 72h @ 25 °C; 15m @ 100 °C; 1h @ 65 °C |
| Dielectric Strength: | 410 V/mil |
| Elongation: | 5% to 7% |
| Flash Point: | >93.3 °C |
| Hardness: | 65 to 80 D |
| Key Specifications: | Code of Federal Regulations Title 21 175.105 (Adhesives) and 175.300 (Resinous and polymeric coatings). |
| Mix Ratio: | 1:1 by volume |
| Service Temperature: | -40 to 150 °C |
| Shear Strength: | 1,550 to 2,500 |
| Specific Gravity: | Part B: 0.98; Mixed: 1.03 to 1.07 |
| Tensile Strength: | 7,500 psi |
| Viscosity: | Part B: 9,000; Mixed: 14,500 to 15,000 |
| Volume Resistivity: | 8.3 x 10^14 ohm-cm |
| Working Time: | 45 to 60min |
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(877) 454-9224Part #: EP750 BLACK - A PL