ResinLab EP1330 Epoxy Adhesive Black 0.75 gal Pail

Part number: EP1330 GL
ResinLab EP1330 Epoxy Adhesive Black 0.75 gal Pail

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ResinLab EP1330 Black is a one component, heat curing, epoxy polymer system that is used for staking, damming, potting, and bonding circuit board components, metals, and plastics. It offers high thermal conductivity, semi-free flowing, low shrinkage, and self leveling properties. 0.75 gal Pail.

ResinLab EP1330 Black is a one component, heat curing, epoxy polymer system that is used for staking, damming, potting, and bonding circuit board components, metals, and plastics. It offers high thermal conductivity, semi-free flowing, low shrinkage, and self leveling properties. 0.75 gal Pail.
Typical Use: Excellent adhesion to a wide variety of plastics, metals and circuit board materials.
Chemical Composition: Epoxy polymer
Color: Black
Components: 1 part
Cure System: Heat
Cure Time: 5 to 10min @ 150 °C
Dielectric Strength: 440 V/mil
Elongation:
Flash Point: >93 °C
Hardness: 90 D
Service Temperature: -40 to 150 °C
Specific Gravity: 1.91
Tensile Strength: 7,000 psi
Thermal Conductivity: 1.07 W/mK
Viscosity: 500,000
Volume Resistivity: 8 x 10^14 ohm-cm