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Part number: EP1330 GL
For current pricing and to place an order please contact your Ellsworth Customer Service Representative.
ResinLab EP1330 Black is a one component, heat curing, epoxy polymer system that is used for staking, damming, potting, and bonding circuit board components, metals, and plastics. It offers high thermal conductivity, semi-free flowing, low shrinkage, and self leveling properties. 0.75 gal Pail.
| Typical Use: | Excellent adhesion to a wide variety of plastics, metals and circuit board materials. |
| Chemical Composition: | Epoxy polymer |
| Color: | Black |
| Components: | 1 part |
| Cure System: | Heat |
| Cure Time: | 5 to 10min @ 150 °C; 15min @ 120 °C; 30min @ 110 °C; 30 to 45min @ 85 °C |
| Dielectric Strength: | 440 V/mil |
| Elongation: | 0 to 1% |
| Flash Point: | >93 °C |
| Hardness: | 90 D |
| Service Temperature: | -40 to 150 °C |
| Shear Strength: | 1,500 |
| Specific Gravity: | 1.93 |
| Tensile Strength: | 7,000 psi |
| Thermal Conductivity: | 0.94 W/mK |
| Viscosity: | 475,000 |
| Volume Resistivity: | 3.6 x 10^16 ohm-cm |
