ResinLab EP1290 Clear is a two component, room temperature and heat curing, unfilled epoxy that is used for bonding plastics and metals. It is semi-flexible, free flowing, has good air release and self leveling. It is resistant to salt solutions, water, impact, vibrations, organic and inorganic solvents. Part B, 5 gal Pail.
| Typical Use: | Designed for bonding metals and plastics. | 
| Chemical Composition: | Epoxy | 
| Color: | Clear | 
| Components: | 2 part | 
| Cure System: | Room Temperature/Heat | 
| Cure Time: | 16 to 24h @ room temperature; 2h @ 65 °C; 20min @ 100 °C | 
| Dielectric Strength: | 850 V/mil | 
| Elongation: | 40% to 50% @ break | 
| Flash Point: | >93 °C | 
| Hardness: | 60 D | 
| Mix Ratio: | 1:1 by volume; 1.22:1 by weight | 
| Service Temperature: | -40 to 150 °C | 
| Shear Strength: | 2,500 | 
| Specific Gravity: | Part B: 0.99; Mixed: 1.08 | 
| Tensile Strength: | 1,600 psi | 
| Thermal Conductivity: | 0.14 W/mK | 
| Viscosity: | Part B: 7,500; Mixed: 30,000 | 
| Volume Resistivity: | 5 x 10^12 ohm-cm | 
| Working Time: | >2h |