ResinLab EP1115 Epoxy Adhesive Part B Clear 5 gal Pail

Part number: EP1115 CLEAR B PL
ResinLab EP1115 Epoxy Adhesive Part B Clear 5 gal Pail

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ResinLab EP1115 Clear is a two component, room and elevated temperature curing, unfilled epoxy adhesive that is used for bonding plastics, metal, and ceramics. It provides good resistance to temperature, salt solutions, water, organic and inorganic solvents. Part B, 5 gal Pail.

ResinLab EP1115 Clear is a two component, room and elevated temperature curing, unfilled epoxy adhesive that is used for bonding plastics, metal, and ceramics. It provides good resistance to temperature, salt solutions, water, organic and inorganic solvents. Part B, 5 gal Pail.
Typical Use: Bonding of metals, ceramics and most plastics.
Chemical Composition: Epoxy
Color: Clear
Components: 2 part
Cure System: Room Temperature
Cure Time: 24h @ room temperature
Dielectric Strength: 440 V/mil
Elongation: 10% to 25%
Flash Point: >93 °C
Hardness: 80 D
Mix Ratio: 1:1
Service Temperature: -40 to 130 °C
Specific Gravity: Part B: 1.05; Mixed: 1.1
Thermal Conductivity: 0.183 W/mK
Viscosity: Part B: 50,000; Mixed: 30,000
Volume Resistivity: 8 x 10^12 ohm-cm
Working Time: 8 to 12min

 

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