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Part number: EP1115 CLEAR B PL
For current pricing and to place an order please contact your Ellsworth Customer Service Representative.
ResinLab EP1115 Clear is a two component, room and elevated temperature curing, unfilled epoxy adhesive that is used for bonding plastics, metal, and ceramics. It provides good resistance to temperature, salt solutions, water, organic and inorganic solvents. Part B, 5 gal Pail.
| Typical Use: | Bonding of metals, ceramics and most plastics. |
| Chemical Composition: | Epoxy |
| Color: | Clear |
| Components: | 2 part |
| Cure System: | Room Temperature |
| Cure Time: | 24h @ room temperature |
| Dielectric Strength: | 440 V/mil |
| Elongation: | 10% to 25% |
| Flash Point: | >93 °C |
| Hardness: | 80 D |
| Mix Ratio: | 1:1 |
| Service Temperature: | -40 to 130 °C |
| Specific Gravity: | Part B: 1.05; Mixed: 1.1 |
| Thermal Conductivity: | 0.183 W/mK |
| Viscosity: | Part B: 50,000; Mixed: 30,000 |
| Volume Resistivity: | 8 x 10^12 ohm-cm |
| Working Time: | 8 to 12min |
