ResinLab OXY-BOND™ 109-DP Two Component Epoxy Clear 50 mL Cartridge

Part number: 109DP CLEAR 50ML
ResinLab OXY-BOND™ 109-DP Two Component Epoxy Clear 50 mL Cartridge
Quantity Price
1-5 $34.61 34.610000000 USD New Available 109DP CLEAR 50ML
6-37 $26.66 26.660000000 USD New Available 109DP CLEAR 50ML
38+ $24.75 24.750000000 USD New Available 109DP CLEAR 50ML
Stocked Item. Usually Ships in 1-2 Business Days. Non-returnable product. Canceled orders may incur a fee at the supplier's discretion.
  • J Haz Class 8

ResinLab OXY-BOND™ 109-DP Epoxy Clear is a two component, room temperature curing, resin that is used for laminating, small potting, and industrial applications. It bonds well to plastics, metal, optical fibers, and ceramics. It offers low viscosity, low shrinkage, wide service temperature range, and durability. It has excellent physical, mechanical, and electrical properties. It is resistant to water, gasoline, oxygen, alcohol, weather, salt solutions, inorganic and organic compounds. 50 mL Cartridge.

 

OXY-BOND™ is a trademark of Henkel and its affiliates in the US and elsewhere, and used under license. Product manufactured under license from Henkel.

<p>ResinLab OXY-BOND&trade; 109-DP Epoxy Clear is a two component, room temperature curing, resin that is used for laminating, small potting, and industrial applications. It bonds well to plastics, metal, optical fibers, and ceramics. It offers low viscosity, low shrinkage, wide service temperature range, and durability. It has excellent physical, mechanical, and electrical properties. It is resistant to water, gasoline, oxygen, alcohol, weather, salt solutions, inorganic and organic compounds. 50 mL Cartridge.</p> <p>&nbsp;</p> <p><span style="color: #ff0000;">OXY-BOND&trade; is a trademark of Henkel and its affiliates in the US and elsewhere, and used under license. Product manufactured under license from Henkel.</span></p>
Typical Use: Recommended for electronic/electrical casting and encapsulating applications. Excellent in high voltage applications, such as power supplies, transformers, bushings and insulators.
Brand: OXY-BOND
Chemical Composition: Resin: Epoxy; Hardener: Polyglycol
Color: Clear
Components: 2 part
Cure System: Room Temperature/Heat
Cure Time: 24h @ 25 °C; 0.5h @ 65 °C
Dielectric Strength: >400 V/mil
Flash Point: Resin: 248.8 °C; Hardener: 139 °C
Hardness: 83 D
Mix Ratio: 100:50 by volume; 100:45 by weight
Service Temperature: -60 to 120 °C
Shear Strength: 2,500 @ 25 °C; 500 @ 100 °C
Specific Gravity: Mixed: 1.15
Tensile Strength: 7,300 psi
Viscosity: Mixed: 2,500 @ 25 °C
Working Time: 0.5h

 

This site uses cookies

We use cookies to provide you with the best possible experience. By using this site, you accept our terms of service and use of cookies.