Dymax Multi-Cure 9001-E-V3.1 UV Curing Encapsulant Clear 10 mL MR Syringe

Part number: 9001-E-V3.1 10ML MR SYR Manufacturer SKU: 9001-E-V3.1/10SYMR
Dymax Multi-Cure 9001-E-V3.1 UV Curing Encapsulant Clear 10 mL MR Syringe
Quantity Price
1 $655.60 ($32.78 each) 655.600000000 USD New Limited Availability 9001-E-V3.1 10ML MR SYR
2 $504.80 ($25.24 each) 504.800000000 USD New Limited Availability 9001-E-V3.1 10ML MR SYR
3+ $468.80 ($23.44 each) 468.800000000 USD New Limited Availability 9001-E-V3.1 10ML MR SYR
Sold as a pack (20/pk).
Usually Ships in 1-2 Business Weeks. Non-returnable product. Canceled orders may incur a fee at the supplier’s discretion.
  • A Made in the USA

DYMAX 9001-E-V3 Series Encapsulant Clear is a one component, UV light and instant curing urethane that is used for bonding electronic devices, print circuit boards, multi-chip modules, chip-on-flex, and chip-on-board applications. It offers flexibility, good electrical properties, and resistance to thermal cycle and moisture. 10 mL MR Syringe.

DYMAX 9001-E-V3 Series Encapsulant Clear is a one component, UV light and instant curing urethane that is used for bonding electronic devices, print circuit boards, multi-chip modules, chip-on-flex, and chip-on-board applications. It offers flexibility, good electrical properties, and resistance to thermal cycle and moisture. 10 mL MR Syringe.
Typical Use: Multi-Cure 9001-E-V3 series encapsulants display excellent adhesion to PC boards and electronic components and are especially well suited for chip on board, chip on flex, and multi-chip modules.
Brand: Multi-Cure
Chemical Composition: Modified urethane
Color: Clear
Components: 1 part
Cure System: UV/Heat
Cure Time: UV Cure: 30s; Heat Cure: 60min @ 110 °C
Dielectric Strength: 500 V/mil
Elongation: 150% @ break
Flash Point: 101 °C
Hardness: 45 D
Tensile Strength: 750 psi @ break
Viscosity: 4,500
Volume Resistivity: 555 x 10^12 ohm-cm

 

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