Thermally Conductive Adhesives,
Encapsulants and Compounds

Thermal Interface Materials – Adhesives, Encapsulants, Compounds or Greases, and Pads are used to dissipate heat in a wide range of electronic devices.  These materials consist of a base synthetic polymer system containing thermally conductive fillers.  The synthetic polymers may be epoxies, silicones or other materials and they may cure or not cure or may be pre-cured (pads).  Ellsworth Adhesives represents many of the world's leading manufacturers of Thermal Interface Materials, including Dow Corning, Henkel Loctite, Emerson and Cuming, and Resinlab.  Click here for information on Electrically Conductive Adhesives.

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