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Resinlab EP1330 Black is a one component, heat curing, epoxy polymer system that is used for staking, damming, potting, and bonding circuit board components, metals, and plastics. It offers high thermal conductivity, semi-free flowing, low shrinkage, and self leveling properties. 0.1 gal Cartridge.
Usually Ships in 1-2 Business Weeks. NON-RETURNABLE.