Henkel Macromelt® polyamide and polyolefin thermoplastics are ideal for protecting electronic assemblies. Low pressure injection molding is used to over-mold electronic components and circuit boards from environmental exposure. Processing cycles are very short relative to other encapsulant systems, typically taking less than one minute per mold cycle. Depending on part size, geometry and tool design, multiple parts can be made with each molding cycle.
The low viscosity of the Macromelt® material allows for insert molding at pressures as low as 1.8 bar (25 psi). The low molding pressure is critical when over-molding and sealing fragile surface mount components, wire bonds and solder joints. Macromelt® resins are 100% solids, one-component systems, maximizing yield and minimizing loss or waste. See Macromelt products in stock.
Come see Henkel present Macromelt capabilities!
Madison Heights, MI, March 16 or 17